Wafers

Glass wafer with low-stress SiN 100nm on both sides, and on top of that, 125nm a-Si on both sides

 

 

Low-stress LPCVD Si/SiO2/Si3N4 wafers (4 inch diameter, 5 micron thick SiO2 layer, and top Si3N4 layer)

 

 

Low-stress LPCVD Si/SiN wafers (4 inch diameter, Si and S3iN4 thickness can be specified)

 

 

Glass (Fused Silica) Wafers (4 inch diameter)