Attachments
Description
WAFER FLAT, UV FUSED SILICA
Outer Diameter : 3.937" +/- 0.008"; 100mm +/- 0.2mm
Thickness: 0.0098" +/- 0.001"; 250um +/- 25um
Polished both sides
Flat: 32.5mm +/- 2.5mm (1.279")
SQ: 40/20
No bevel, 0.010" max chip